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337TMA035M

337TMA035M

337TMA035M

Illinois Capacitor

CAP ALUM 330UF 20% 35V THRU HOLE

SOT-23

337TMA035M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 22 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Axial, Can
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~105°C
PackagingBulk
Published 2016
Series TMA
Size / Dimension 0.394Diax0.827L 10.00mmx21.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications Bypass, Decoupling
Voltage - Rated 35V
Capacitance 330μF
Packing Method TR
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 703mOhm @ 120Hz
Rated (DC) Voltage (URdc) 35V
Lifetime @ Temp 2000 Hrs @ 105°C
Leakage Current 0.347mA
Polarization Polar
Tan Delta 0.14
Ripple Current @ Low Frequency 330mA @ 120Hz
Ripple Current @ High Frequency 495mA @ 50kHz
Diameter 10mm
Length 21mm
RoHS StatusROHS3 Compliant
In-Stock:14159 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 337TMA035M

The 337TMA035M from Illinois Capacitor is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 330UF 20% 35V THRU HOLE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 337TMA035M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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