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108SMH6R3M

108SMH6R3M

108SMH6R3M

Illinois Capacitor

CAP ALUM 1000UF 20% 6.3V SMD

SOT-23

108SMH6R3M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 22 Weeks
Mounting Type Surface Mount
Package / Case Radial, Can - SMD
Terminal Shape FLAT
Dielectric MaterialALUMINUM (WET)
Surface Mount Land Size 0.327Lx0.327W 8.30mmx8.30mm
Operating Temperature-55°C~105°C
PackagingBulk
Published 2016
Series SMH
Size / Dimension 0.315Dia 8.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications Bypass, Decoupling
Voltage - Rated 6.3V
Capacitance 1000μF
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 464.2mOhm @ 120Hz
Rated (DC) Voltage (URdc) 6.3V
Size Code 3333
Lifetime @ Temp 1000 Hrs @ 105°C
Leakage Current 0.063mA
Polarization Polar
Tan Delta 0.28
Ripple Current @ Low Frequency 340mA @ 120Hz
Ripple Current @ High Frequency 510mA @ 100kHz
Height Seated (Max) 0.433 11.00mm
RoHS StatusROHS3 Compliant
In-Stock:31579 items

Pricing & Ordering

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About 108SMH6R3M

The 108SMH6R3M from Illinois Capacitor is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 1000UF 20% 6.3V SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 108SMH6R3M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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