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FX61UT00S08SV

FX61UT00S08SV

FX61UT00S08SV

HIROSEELECTRICCOLTD

FX61UT00S08SV datasheet pdf and Evaluation, Development Board Enclosures product details from HIROSEELECTRICCOLTD stock available on our website

SOT-23

FX61UT00S08SV Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time NRND (Last Updated: 1 week ago)
Lifecycle Status 21 Weeks
Mount Chassis
Mounting Type -
Package / Case SOT-23
Number of Pins 4
Operating Temperature 0°C ~ 125°C
Packaging Tape & Reel (TR)
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 9
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Operational Amplifier
Voltage - Supply 8V ~ 36V
Base Part Number Vsi Bog
Output Voltage 65 V
Output Type N-Channel
Interface -
Termination Type SOLDER
Operating Supply Current 1.5 mA
Nominal Supply Current 1.5 mA
Output Current -
Max Supply Current -
Slew Rate 0.1V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type -
In-Stock:1122 items

About FX61UT00S08SV

The FX61UT00S08SV from HIROSEELECTRICCOLTD is a high-performance microcontroller designed for a wide range of embedded applications. This component features FX61UT00S08SV datasheet pdf and Evaluation, Development Board Enclosures product details from HIROSEELECTRICCOLTD stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the FX61UT00S08SV, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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