Name: FX11LA-100P/10-SV(91)
Brand: Hirose Electric Co Ltd
SKU: FX11LA-100P/10-SV(91)
Price: 5.86000 USD
Availability: InStock

new-10%

FX11LA-100P/10-SV(91)

Manufacturer part number:FX11LA-100P/10-SV(91)

Manufacturer:Hirose Electric Co Ltd

Description:Header, Outer Shroud Contacts Cut Tape (CT) 2 Rows 0.020 0.50mm Surface Mount 100 Positions FX11 Gold SMD/SMT COPPER ALLOY

Case Package:SOT-23

Datasheet:FX11LA-100P/10-SV(91) Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Contact Material	COPPER ALLOY
Mounting Type	Surface Mount
Insulation Material	LIQUID CRYSTAL POLYMER (LCP)
Mounting Option 1	LOCKING
Board Mounting Option	PEG
Packaging	Cut Tape (CT)
Published	2013
Series	FX11
Feature	Board Guide, Ground Plate, Solder Retention
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	SMD/SMT
ECCN Code	EAR99
Connector Type	Header, Outer Shroud Contacts
Number of Positions	100
Number of Rows	2
HTS Code	8536.69.40.40
Subcategory	Headers and Edge Type Connectors
Pitch	0.020 0.50mm
Total Number of Contacts	100
Reach Compliance Code	unknown
Number of Conductors	ONE
Reference Standard	UL
Contact Finish	Gold
Reliability	COMMERCIAL
Body Length or Diameter	1.36 inch
Number Of PCB Rows	2
PCB Contact Pattern	RECTANGULAR
Operating Temperature (Max)	85°C
Operating Temperature (Min)	-55°C
Body Depth	0.099 inch
Rated Current (Signal)	0.3A
Contact Style	BELLOWED TYPE
Contact Resistance	70mOhm
Polarization Key	POLARIZED HOUSING
PCB Contact Row Spacing	4.7498 mm
Durability	50 Cycles
Contact Pattern	RECTANGULAR
Insulator Color	BEIGE
Contact Finish Thickness	3.94μin 0.10μm
Height Above Board	0.075 1.90mm
Stack Height	2mm
RoHS Status	RoHS Compliant
Lead Free	Lead Free

FX11LA-100P/10-SV(91) Product Details

FX11LA-100P/10-SV(91) Overview

The packaging contains Header, Outer Shroud Contacts.This product is packaged in a case marked Cut Tape (CT).There is a Surface Mount mounting type for the device.Product number FX11 belongs to the FX11 Series.Operating the device, it is possible to maintain Board Guide, Ground Plate, Solder Retention.