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DF1-3P-2.5DSA(05)

DF1-3P-2.5DSA(05)

DF1-3P-2.5DSA(05)

Hirose Electric Co Ltd

Conn Wire to Board HDR 3 POS 2.5mm Solder ST Thru-Hole Bag

SOT-23

DF1-3P-2.5DSA(05) Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialBrass
Mounting Type Through Hole
Contact Shape Square
Insulation Material Polyamide (PA), Nylon
Housing Material Polyamide
Mounting Option 1 LOCKING
Operating Temperature-30°C~85°C
PackagingBulk
Series DF1
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 3
Number of Rows 1
Additional FeatureLOW PROFILE
Fastening TypeFriction Lock
Contact Finish - Mating Tin
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Orientation Straight
Terminal Pitch2.5mm
Depth 6mm
Insulation Height 0.295 7.50mm
Style Board to Cable/Wire
Number of Positions Loaded All
Current Rating3A
Pitch - Mating 0.098 2.50mm
Insulation Color Brown
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Contact Length - Post 0.118 3.00mm
Shrouding Shrouded - 1 Wall
Number Of PCB Rows 1
Contact Length - Mating 0.177 4.50mm
PCB Contact Pattern RECTANGULAR
Contact Gender Male
UL Flammability Code 94V-0
Overall Contact Length 0.394 10.00mm
Contact Resistance 30mOhm
Mating Contact Pitch 0.098 inch
Max Voltage Rating (AC) 250V
Max Current Rating 3A
Polarization Key POLARIZED HOUSING
Dielectric Withstanding Voltage 650VAC V
Wire Gauge (Max) 28 AWG
Wire Gauge (Min) 24 AWG
Withdrawl Force-Min .556 N
Length 10mm
Contact Finish Thickness - Mating 39.4μin 1.00μm
Material Flammability Rating UL94 V-0
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:19454 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.288000$0.288
10$0.271698$2.71698
100$0.256319$25.6319
500$0.241810$120.905
1000$0.228123$228.123

About DF1-3P-2.5DSA(05)

The DF1-3P-2.5DSA(05) from Hirose Electric Co Ltd is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Wire to Board HDR 3 POS 2.5mm Solder ST Thru-Hole Bag.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DF1-3P-2.5DSA(05), including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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