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H9037-01

H9037-01

H9037-01

Harwin Inc.

H9037-01 datasheet pdf and Terminals - Turret Connectors product details from Harwin Inc. stock available on our website

SOT-23

H9037-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Contact MaterialBrass Alloy
Contact PlatingTin
Mount Through Hole
Mounting Type Through Hole
Body Material Brass
Mounting Hole Diameter 0.064 ~ 0.068 (1.63mm ~ 1.72mm)
Published 2006
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Swage
ECCN Code EAR99
Gender Male
HTS Code8536.90.40.00
Depth 2.38mm
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypeSingle End, Fork, Hollow
Hole Diameter 1.7272 mm
Flange Diameter0.094 (2.39mm)
Number of Turrets Single
Staking Side OD 0.061 ~ 0.064 (1.55mm ~ 1.63mm)
Length 7.1374mm
Length - Overall 0.281 7.14mm
Board Thickness 0.094 2.39mm
Length - Below Flange 0.094 ~ 0.099 2.39mm ~ 2.51mm
Length - Above Board 0.156 3.96mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:1766 items

About H9037-01

The H9037-01 from Harwin Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features H9037-01 datasheet pdf and Terminals - Turret Connectors product details from Harwin Inc. stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H9037-01, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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