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H8504-01

H8504-01

H8504-01

Harwin Inc.

Circuit Board Hardware - PCB .8mm PC BOARD SOCKET TIN

SOT-23

H8504-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Contact MaterialBeryllium Copper
Contact PlatingGold, Tin
Mount Through Hole
Material Brass
Mounting Hole Diameter 0.075 ~ 0.079 (1.91mm ~ 2.01mm)
Operating Temperature-55°C~125°C
PackagingBulk
Published 2010
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, Socket
HTS Code8536.90.40.00
Contact Finish Gold
Plating Tin
Hole Diameter 2.0066 mm
Flange Diameter0.093 (2.36mm)
Outside Diameter2.35 mm
Tail Type No Tail
Accepts Pin Diameter 0.024 ~ 0.033 (0.60mm ~ 0.85mm)
Socket Depth 0.183 4.65mm
Insertion Force 1.50N ~ 5.01N
Length 5.6896mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.224 5.69mm
RoHS StatusROHS3 Compliant
In-Stock:14771 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.41000$0.41
10$0.39200$3.92
25$0.33600$8.4
50$0.28560$14.28
100$0.27440$27.44
250$0.24640$61.6
500$0.23520$117.6

About H8504-01

The H8504-01 from Harwin Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Circuit Board Hardware - PCB .8mm PC BOARD SOCKET TIN.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H8504-01, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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