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H3490-01

H3490-01

H3490-01

Harwin Inc.

CONN PIN RCPT .079 SOLDER

SOT-23

H3490-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Contact MaterialBeryllium Copper
Contact PlatingGold, Tin
Mount Through Hole
Material Brass
Mounting Hole Diameter 0.144 ~ 0.148 (3.66mm ~ 3.77mm)
Operating Temperature-55°C~125°C
PackagingBulk
Published 2010
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, Socket
HTS Code8536.90.40.00
Current Rating20A
Contact Finish Gold
Plating Tin
Terminal and Terminal Block Type PCB TERMINAL
Hole Diameter 3.7592 mm
Flange Diameter0.187 (4.75mm)
Outside Diameter4.75 mm
Tail Type No Tail
Accepts Pin Diameter 0.079 ~ 0.091 (2.00mm ~ 2.30mm)
Socket Depth 0.161 4.09mm
Insertion Force 2.99N ~ 6.00N
Length 10.5918mm
Contact Finish Thickness 3.94μin 0.10μm
Length - Overall 0.417 10.59mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:5571 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.192508$1.192508
10$1.125007$11.25007
100$1.061328$106.1328
500$1.001252$500.626
1000$0.944578$944.578

About H3490-01

The H3490-01 from Harwin Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PIN RCPT .079 SOLDER.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H3490-01, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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