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H2105-01

H2105-01

H2105-01

Harwin Inc.

CONN PC PIN CIRC 0.032DIA TIN

SOT-23

H2105-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Contact MaterialBrass
Contact PlatingTin
Mount Through Hole
Mounting Type Through Hole
Mounting Hole Diameter 0.052 ~ 0.056 (1.32mm ~ 1.42mm)
PackagingBulk
Published 2009
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Swage
ECCN Code EAR99
Gender Female
HTS Code8536.90.40.00
Depth 2.4mm
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypePC Pin
Hole Diameter 1.41 mm
Wire Cross Section 38.9 mm2
Flange Diameter0.094 (2.39mm)
Outside Diameter2.39 mm
Terminal Style Double End
Pin Size - Above Flange 0.032 0.81mm Dia
Length 9.525mm
Length - Overall 0.375 9.53mm
Diameter - Inside 1.32 mm
Board Thickness 0.063 1.60mm
Length - Below Flange 0.199 5.05mm
Length - Above Flange 0.156 3.96mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:73246 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.257000$0.257
10$0.242453$2.42453
100$0.228729$22.8729
500$0.215782$107.891
1000$0.203568$203.568

About H2105-01

The H2105-01 from Harwin Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PC PIN CIRC 0.032DIA TIN.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H2105-01, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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