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B5743-206-M-L-3

B5743-206-M-L-3

B5743-206-M-L-3

Harwin Inc.

Headers & Wire Housings 6P DIL MALE HORIZ 2MM PC TAIL

SOT-23

B5743-206-M-L-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Contact MaterialBronze
Contact PlatingGold
Mounting Type BOARD
Housing Material Polyester
Published 2015
JESD-609 Code e0
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type BOARD CONNECTOR
Number of Positions 6
Max Operating Temperature125°C
Min Operating Temperature -55°C
Number of Rows 2
Additional FeatureLATCHED
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 2mm
Total Number of Contacts 6
Orientation Right Angle
Depth 11.6mm
Contact Gender Male
UL Flammability Code 94V-0
Housing Color Black
Contact Resistance 25mOhm
Body/Shell Style PLUG
Max Voltage Rating (AC) 120V
Max Current Rating 3A
Max Voltage Rating (DC) 120V
Length 10.1mm
RoHS StatusRoHS Compliant
In-Stock:799 items

Pricing & Ordering

QuantityUnit PriceExt. Price
78$7.14397$557.22966

About B5743-206-M-L-3

The B5743-206-M-L-3 from Harwin Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Headers & Wire Housings 6P DIL MALE HORIZ 2MM PC TAIL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B5743-206-M-L-3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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