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166F25

166F25

166F25

Hammond Manufacturing

XFRMR LAMINATED 7.5VA CHAS MOUNT

SOT-23

166F25 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Chassis Mount, Panel
Mounting Type Chassis Mount
Weight 0.7lb 317.51g
Published 2000
Series 166
Size / Dimension 71.37mm Lx38.10mm W
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Wire Leads
Type Laminated Core
Max Operating Temperature130°C
Min Operating Temperature 0°C
Power Rating 7.5W
Max Power Dissipation7.5W
Current Rating300mA
Frequency 60Hz
Termination Style Wire Leads
Approval Agency CSA, UL
Voltage - Isolation 2000Vrms
Output Voltage 25V
Max Output Current300mA
Current - Output (Max) 300mA
Output Current300mA
Power - Max 7.5VA
Nominal Input Voltage115V
Voltage - Primary 115V
Primary Winding(s) Single
Center TapYes
Voltage - Secondary (Full Load) 25V
Secondary Winding(s) Single
Height 42.93mm
Height Seated (Max) 42.93mm
Length 71.37mm
Width 38.1mm
RoHS StatusROHS3 Compliant
In-Stock:359 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$22.98000$22.98
10$20.28000$202.8
25$19.60400$490.1
50$17.57600$878.8
100$16.90000$1690

About 166F25

The 166F25 from Hammond Manufacturing is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 7.5VA CHAS MOUNT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 166F25, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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