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161E56

161E56

161E56

Hammond Manufacturing

XFRMR LAMINATED 1.2VA THRU HOLE

SOT-23

161E56 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole
Weight 0.25lb 113.4g
Series 161
Size / Dimension 35.05mm Lx30.23mm W
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination PC Pin
ECCN Code EAR99
Type Laminated Core
Max Operating Temperature130°C
Min Operating Temperature 0°C
Additional FeaturePCB MOUNTABLE
HTS Code8504.31.40.35
Power Rating 1.2W
Max Power Dissipation1.2W
Termination Style PC Pin
Approval Agency UL; CSA
Voltage - Isolation 2000Vrms
Max Output Current20mA
Current - Output (Max) Parallel 40mA Series 20mA
Power - Max 1.2VA
Voltage - Primary 115V
Primary Winding(s) Single
Center TapNo
Voltage - Secondary (Full Load) Parallel 28V Series 56V
Secondary Winding(s) Single, Multiple Taps
VA Rating 1.2 VA
Height 30.988mm
Height Seated (Max) 30.99mm
RoHS StatusROHS3 Compliant
In-Stock:554 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$9.94000$9.94
10$7.61400$76.14
25$6.45080$161.27
50$6.34500$317.25
100$6.02780$602.78
250$5.96432$1491.08
500$5.87970$2939.85

About 161E56

The 161E56 from Hammond Manufacturing is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 1.2VA THRU HOLE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 161E56, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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