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160F56

160F56

160F56

Hammond Manufacturing

XFRMR LAMINATED 4.4VA THRU HOLE

SOT-23

160F56 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mount Through Hole
Mounting Type Through Hole
Weight 0.32lb 145.15g
Published 2000
Series 160
Size / Dimension 42.93mm Lx31.75mm W
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination PC Pin
ECCN Code EAR99
Type Laminated Core
Max Operating Temperature130°C
Min Operating Temperature 0°C
Additional FeaturePCB MOUNTABLE
HTS Code8504.31.40.35
Power Rating 4.4W
Max Power Dissipation4.4W
Termination Style PC Pin
Approval Agency UL; CSA
Voltage - Isolation 2000Vrms
Max Output Current80mA
Current - Output (Max) Parallel 160mA Series 80mA
Power - Max 4.4VA
Voltage - Primary 115V 230V
Primary Winding(s) Dual
Center TapNo
Voltage - Secondary (Full Load) Parallel 28V Series 56V
Secondary Winding(s) Single, Multiple Taps
VA Rating 4.4 VA
Height 36.83mm
RoHS StatusROHS3 Compliant
In-Stock:549 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$11.62000$11.62
10$8.58000$85.8
25$7.92000$198
50$7.65600$382.8
100$7.44480$744.48
250$7.33920$1834.8
500$7.26000$3630

About 160F56

The 160F56 from Hammond Manufacturing is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 4.4VA THRU HOLE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 160F56, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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