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GD25VE16CEIGR

GD25VE16CEIGR

GD25VE16CEIGR

GigaDevice Semiconductor (HK) Limited

Memory IC

SOT-23

GD25VE16CEIGR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-XFDFN Exposed Pad
Operating Temperature-40°C~85°C TA
PackagingTape & Reel (TR)
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology FLASH - NOR
Voltage - Supply 2.1V~3.6V
Memory Size16Mb 2M x 8
Memory TypeNon-Volatile
Clock Frequency 104MHz
Memory Format FLASH
Memory InterfaceSPI - Quad I/O
RoHS StatusROHS3 Compliant
In-Stock:1036 items

Pricing & Ordering

QuantityUnit PriceExt. Price

GD25VE16CEIGR Product Details

GD25VE16CEIGR Overview


In this case, the memory type of the device can be classified as Non-Volatile. You can get memory ics in a Tape & Reel (TR) case. The file is embedded in a 8-XFDFN Exposed Pad case. Memory size on the chip is 16Mb 2M x 8. FLASH-format memory is used in this device, which is a mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. A voltage of 2.1V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. There is a clock frequency rotation of the memory within a 104MHz range.

GD25VE16CEIGR Features


Package / Case: 8-XFDFN Exposed Pad

GD25VE16CEIGR Applications


There are a lot of GigaDevice Semiconductor (HK) Limited GD25VE16CEIGR Memory applications.

  • eDRAM
  • workstations,
  • Camcorders
  • eSRAM
  • main computer memory
  • mainframes
  • personal computers
  • multimedia computers
  • cell phones
  • nonvolatile BIOS memory

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