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GD25LE32DLIGR

GD25LE32DLIGR

GD25LE32DLIGR

GigaDevice Semiconductor (HK) Limited

Memory IC

SOT-23

GD25LE32DLIGR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 21-XFBGA, WLSCP
Operating Temperature-40°C~85°C TA
PackagingTape & Reel (TR)
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology FLASH - NOR
Voltage - Supply 1.65V~2V
Memory Size32Mb 4M x 8
Memory TypeNon-Volatile
Clock Frequency 120MHz
Memory Format FLASH
Memory InterfaceSPI - Quad I/O
Write Cycle Time - Word, Page 2.4ms
RoHS StatusROHS3 Compliant
In-Stock:2807 items

Pricing & Ordering

QuantityUnit PriceExt. Price

GD25LE32DLIGR Product Details

GD25LE32DLIGR Overview


As far as memory types are concerned, Non-Volatile is considered to be its memory type. You can get memory ics in a Tape & Reel (TR) case. An embedded 21-XFBGA, WLSCP case surrounds memory ics. On the chip, there is an 32Mb 4M x 8 memory, which is the size of the chip's memory. There is a mainstream memory format used by this device, which is called FLASH-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. The supply voltage can be up to 1.65V~2V. The recommended mounting type for this device is Surface Mount. There is a clock frequency rotation of the memory within a 120MHz range.

GD25LE32DLIGR Features


Package / Case: 21-XFBGA, WLSCP

GD25LE32DLIGR Applications


There are a lot of GigaDevice Semiconductor (HK) Limited GD25LE32DLIGR Memory applications.

  • supercomputers
  • eSRAM
  • cell phones
  • multimedia computers
  • servers
  • networking
  • main computer memory
  • personal digital assistants
  • graphics card
  • networks

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