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GB100XCP12-227

GB100XCP12-227

GB100XCP12-227

GeneSiC Semiconductor

IGBT Modules 1200V 100A SIC IGBT CoPak

SOT-23

GB100XCP12-227 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Chassis Mount
Mounting Type Chassis Mount
Package / Case SOT-227-4
Number of Pins 4
Weight 30.000004g
Operating Temperature-40°C~175°C TJ
PackagingBulk
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Polarity NPN
Configuration Single
Input Standard
Collector Emitter Voltage (VCEO) 2V
Max Collector Current 100A
Current - Collector Cutoff (Max) 1mA
Collector Emitter Breakdown Voltage1.2kV
Voltage - Collector Emitter Breakdown (Max) 1200V
Collector Emitter Saturation Voltage1.9V
Input Capacitance8.55nF
Vce(on) (Max) @ Vge, Ic 2V @ 15V, 100A
IGBT Type PT
NTC ThermistorNo
Input Capacitance (Cies) @ Vce 8.55nF @ 25V
RoHS StatusRoHS Compliant
In-Stock:4373 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$223.62000$223.62
10$212.82900$2128.29
25$205.63200$5140.8

About GB100XCP12-227

The GB100XCP12-227 from GeneSiC Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features IGBT Modules 1200V 100A SIC IGBT CoPak.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the GB100XCP12-227, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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