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MB86060PMCR-G-BNDE1

MB86060PMCR-G-BNDE1

MB86060PMCR-G-BNDE1

Fujitsu Electronics America, Inc.

DAC

SOT-23

MB86060PMCR-G-BNDE1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case LQFP
Max Operating Temperature85°C
Min Operating Temperature -40°C
Interface Serial
Number of Bits 12
Supply Type Analog, Digital
Number of Converters 1
RoHS StatusRoHS Compliant
In-Stock:1955 items

MB86060PMCR-G-BNDE1 Product Details

MB86060PMCR-G-BNDE1 Overview


There are two packages that contain it: LQFP package and X package. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. During its maximal operating temperature, this module reaches 85°C. In order to achieve -40°C, the operating temperature must be higher than -40°C.

MB86060PMCR-G-BNDE1 Features


LQFP package


MB86060PMCR-G-BNDE1 Applications


There are a lot of Fujitsu Electronics America, Inc.
MB86060PMCR-G-BNDE1 Digital to Analog Converters (DAC) applications.


  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation

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