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RS03UTK751JT

RS03UTK751JT

RS03UTK751JT

FHGUANGDONGFENGHUAADVANCEDTECH

RS03UTK751JT datasheet pdf and Evaluation, Development Board Enclosures product details from FHGUANGDONGFENGHUAADVANCEDTECH stock available on our website

SOT-23

RS03UTK751JT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 1 day ago)
Lifecycle Status 16 Weeks
Mount Flanges
Mounting Type -
Package / Case -
Number of Pins 5
Operating Temperature 0°C ~ 70°C
Packaging Bulk
Pbfree Code -
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient -
Subcategory Other Sensors/Transducers
Voltage - Supply 10V ~ 40V
Base Part Number Cscbxi Clps
Output Voltage 28 V
Output Type N-Channel
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 1 mA
Nominal Supply Current -
Output Current 40 mA
Max Supply Current 700 μA
Slew Rate 0.3V/μs
Architecture -
Amplifier Type General Purpose
In-Stock:3044 items

About RS03UTK751JT

The RS03UTK751JT from FHGUANGDONGFENGHUAADVANCEDTECH is a high-performance microcontroller designed for a wide range of embedded applications. This component features RS03UTK751JT datasheet pdf and Evaluation, Development Board Enclosures product details from FHGUANGDONGFENGHUAADVANCEDTECH stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RS03UTK751JT, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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