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HR3UUT1700F9

HR3UUT1700F9

HR3UUT1700F9

FDKAMERICAINCAMEMBEROFFUJITSUGROUP

HR3UUT1700F9 datasheet pdf and Evaluation, Development Board Enclosures product details from FDKAMERICAINCAMEMBEROFFUJITSUGROUP stock available on our website

SOT-23

HR3UUT1700F9 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 1 day ago)
Lifecycle Status 24 Weeks
Mount Press Fit, Through Hole
Mounting Type -
Package / Case SOIC
Number of Pins 7
Operating Temperature -40°C ~ 110°C
Packaging Tube
Pbfree Code -
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1
Number of Terminations 5
ECCN Code EAR99
Temperature Coefficient POSITIVE ppm/°C
Subcategory -
Voltage - Supply 4V ~ 30V
Base Part Number Igs Agdsl
Output Voltage 46 V
Output Type P-Channel
Interface -
Termination Type -
Operating Supply Current 80 μA
Nominal Supply Current 10 mA
Output Current 70 mA
Max Supply Current 1.5 mA
Slew Rate 0.6V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type -
In-Stock:2539 items

About HR3UUT1700F9

The HR3UUT1700F9 from FDKAMERICAINCAMEMBEROFFUJITSUGROUP is a high-performance microcontroller designed for a wide range of embedded applications. This component features HR3UUT1700F9 datasheet pdf and Evaluation, Development Board Enclosures product details from FDKAMERICAINCAMEMBEROFFUJITSUGROUP stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HR3UUT1700F9, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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