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MSPM-6-01

MSPM-6-01

MSPM-6-01

Essentra Components

MSPM-6-01 datasheet pdf and Board Supports product details from Essentra Components stock available on our website

SOT-23

MSPM-6-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Mount Chassis
Mounting Type Snap Lock
Package / Case 125
Material Nylon
Mounting Hole Diameter 0.125 (3.18mm) 1/8
Series Richco, MSPM
Published 2002
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Color Clear
Gender Male to Male
Hole Diameter 3.175 mm
Holding Type Snap Fit
Support Hole Diameter 0.125 (3.18mm) 1/8
Diameter 4.572mm
Height 9.525mm
Length 16.891mm
Width 3.175mm
Length - Overall 0.665 16.90mm
PCB Thickness 1.57mm
Between Board Height 0.375 9.53mm 3/8
Support Panel Thickness 0.062 1.57mm 1/16
Mounting Panel Thickness 0.062 1.57mm 1/16
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:30177 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.647036$0.647036
10$0.610412$6.10412
100$0.575860$57.586
500$0.543264$271.632
1000$0.512513$512.513

About MSPM-6-01

The MSPM-6-01 from Essentra Components is a high-performance microcontroller designed for a wide range of embedded applications. This component features MSPM-6-01 datasheet pdf and Board Supports product details from Essentra Components stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MSPM-6-01, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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