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LCBSM-3-01

LCBSM-3-01

LCBSM-3-01

Essentra Components

LCBSM-3-01 datasheet pdf and Board Supports product details from Essentra Components stock available on our website

SOT-23

LCBSM-3-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Mount PCB
Mounting Type Snap Lock
Material Nylon
Mounting Hole Diameter 0.125 (3.18mm) 1/8
Series Richco, LCBSM
Published 2007
Feature Winged
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Hole Diameter 3.175 mm
Holding Type Snap Lock
Support Hole Diameter 0.125 (3.18mm) 1/8
Diameter 3.175mm
Height 4.8mm
Length 19.9898mm
Width 4.4mm
Length - Overall 0.787 20.00mm
PCB Thickness 1.57mm
Between Board Height 0.188 4.78mm 3/16
Support Panel Thickness 0.062 1.57mm 1/16
Mounting Panel Thickness 0.031 ~ 0.078 0.79mm ~ 1.98mm
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:18349 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.380000$0.38
10$0.358491$3.58491
100$0.338199$33.8199
500$0.319055$159.5275
1000$0.300996$300.996

About LCBSM-3-01

The LCBSM-3-01 from Essentra Components is a high-performance microcontroller designed for a wide range of embedded applications. This component features LCBSM-3-01 datasheet pdf and Board Supports product details from Essentra Components stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LCBSM-3-01, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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