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EPC2014

EPC2014

EPC2014

EPC

TRANS GAN 40V 10A BUMPED DIE

SOT-23

EPC2014 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die Outline (5-Solder Bar)
Operating Temperature-40°C~150°C TJ
PackagingCut Tape (CT)
Published 2013
Series eGaN®
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology GaNFET (Gallium Nitride)
FET Type N-Channel
Rds On (Max) @ Id, Vgs 16mOhm @ 5A, 5V
Vgs(th) (Max) @ Id 2.5V @ 2mA
Input Capacitance (Ciss) (Max) @ Vds 325pF @ 20V
Current - Continuous Drain (Id) @ 25°C 10A Ta
Gate Charge (Qg) (Max) @ Vgs 2.8nC @ 5V
Drain to Source Voltage (Vdss) 40V
Drive Voltage (Max Rds On,Min Rds On) 5V
Vgs (Max) +6V, -5V
Continuous Drain Current (ID) 10A
Input Capacitance325pF
Rds On Max 16 mΩ
RoHS StatusROHS3 Compliant
In-Stock:4665 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About EPC2014

The EPC2014 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features TRANS GAN 40V 10A BUMPED DIE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2014, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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