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T55F324I4

T55F324I4

T55F324I4

Efinix, Inc.

FPGAs 324-VFBGA

SOT-23

T55F324I4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-VFBGA
Operating Temperature-40°C~100°C TJ
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.15V~1.25V
Number of I/O 130
Number of Logic Elements/Cells 54195
Total RAM Bits 2831360
RoHS StatusROHS3 Compliant
In-Stock:293 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$34.12000$34.12
500$33.7788$16889.4
1000$33.4376$33437.6
1500$33.0964$49644.6
2000$32.7552$65510.4
2500$32.414$81035

T55F324I4 Product Details

T55F324I4 Overview


A 324-VFBGA package is provided with this component. A total of 130 I/Os are programmed to ensure a more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. An attachment Surface Mount allows the FPGA module to be attached to the development board. A supply voltage of 1.15V~1.25V is needed in order for fpga chips to operate. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. As a space-saving measure, this FPGA model is contained within Tray. There are 2831360 RAM bits that are available with this device.

T55F324I4 Features


130 I/Os
Up to 2831360 RAM bits

T55F324I4 Applications


There are a lot of Efinix, Inc. T55F324I4 FPGAs applications.

  • Digital signal processing
  • Secure Communication
  • Solar Energy
  • Wired Communications
  • Embedded Vision
  • Consumer Electronics
  • Military Temperature
  • Development Boards and Shields for Microcontrollers
  • Ecosystem
  • Filtering and communication encoding

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