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T55F324C3

T55F324C3

T55F324C3

Efinix, Inc.

FPGAs 324-VFBGA

SOT-23

T55F324C3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 324-VFBGA
Operating Temperature0°C~85°C TJ
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.15V~1.25V
Number of I/O 130
Number of Logic Elements/Cells 54195
Total RAM Bits 2831360
RoHS StatusROHS3 Compliant
In-Stock:361 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$25.88000$25.88
500$25.6212$12810.6
1000$25.3624$25362.4
1500$25.1036$37655.4
2000$24.8448$49689.6
2500$24.586$61465

T55F324C3 Product Details

T55F324C3 Overview


As part of the 324-VFBGA package, it is included. The device has 130 I/O ports for more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 1.15V~1.25V . As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. As a space-saving measure, this FPGA model is contained within Tray. A device like this one offers 2831360 RAM bits, which is a considerable amount of memory.

T55F324C3 Features


130 I/Os
Up to 2831360 RAM bits

T55F324C3 Applications


There are a lot of Efinix, Inc. T55F324C3 FPGAs applications.

  • Data Mining
  • Digital signal processing
  • Consumer Electronics
  • Device controllers
  • Radar and Sensors
  • Image processing
  • Telecommunication
  • Medical Applications
  • Electronic Warfare
  • Development Boards and Shields for Microcontrollers

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