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T13F169C3

T13F169C3

T13F169C3

Efinix, Inc.

FPGAs 169-VFBGA

SOT-23

T13F169C3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mounting Type Surface Mount
Package / Case 169-VFBGA
Operating Temperature0°C~85°C TJ
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.15V~1.25V
Number of I/O 73
Number of Logic Elements/Cells 12828
Total RAM Bits 744489
RoHS StatusROHS3 Compliant
In-Stock:938 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.47000$7.47
500$7.3953$3697.65
1000$7.3206$7320.6
1500$7.2459$10868.85
2000$7.1712$14342.4
2500$7.0965$17741.25

T13F169C3 Product Details

T13F169C3 Overview


A 169-VFBGA package is provided with this component. This device features 73 I/Os in order to transfer data in a more efficient manner. To form a fundamental building block, there are 12828 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.15V~1.25V , at which it runs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. There are 744489 RAM bits that are available with this device.

T13F169C3 Features


73 I/Os
Up to 744489 RAM bits

T13F169C3 Applications


There are a lot of Efinix, Inc. T13F169C3 FPGAs applications.

  • Medical ultrasounds
  • Consumer Electronics
  • Artificial intelligence (AI)
  • Secure Communication
  • Cryptography
  • Industrial IoT
  • High Performance Computing
  • Ecosystem
  • Integrating multiple SPLDs
  • Data center hardware accelerators

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