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3070UT37558178

3070UT37558178

3070UT37558178

EDACINC

3070UT37558178 datasheet pdf and Evaluation, Development Board Enclosures product details from EDACINC stock available on our website

SOT-23

3070UT37558178 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time LAST SHIPMENTS (Last Updated: 4 days ago)
Lifecycle Status 8 Weeks
Mount Surface Mount
Mounting Type Press Fit, Through Hole
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 3
Operating Temperature -55°C ~ 150°C
Packaging Bulk
Pbfree Code -
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1
Number of Terminations 6
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Operational Amplifier
Voltage - Supply 20V ~ 50V
Base Part Number Oeqs Lbtq
Output Voltage 38 V
Output Type N-Channel
Interface Analog
Termination Type SOLDER
Operating Supply Current 700 μA
Nominal Supply Current 800 μA
Output Current 20 mA
Max Supply Current 800 μA
Slew Rate 0.1V/μs
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4208 items

About 3070UT37558178

The 3070UT37558178 from EDACINC is a high-performance microcontroller designed for a wide range of embedded applications. This component features 3070UT37558178 datasheet pdf and Evaluation, Development Board Enclosures product details from EDACINC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3070UT37558178, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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