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638-M62-632-BN3

638-M62-632-BN3

638-M62-632-BN3

EDAC Inc.

638M SERIES VERTICAL D-SUB RECEP

SOT-23

638-M62-632-BN3 Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Contact Plating30 Microinches of Gold Plating
Mounting Feature#4-40 UNC Insert + Board Spacer
Gender Receptacle (Socket)
Position 62
Contact Description Solder Cup
Insulator Color Black
Shell PlatingNickel
In-Stock:255 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$32.82000$32.82
500$32.4918$16245.9
1000$32.1636$32163.6
1500$31.8354$47753.1
2000$31.5072$63014.4
2500$31.179$77947.5

About 638-M62-632-BN3

The 638-M62-632-BN3 from EDAC Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features 638M SERIES VERTICAL D-SUB RECEP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 638-M62-632-BN3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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