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638-M26-332-BN3

638-M26-332-BN3

638-M26-332-BN3

EDAC Inc.

638M SERIES VERTICAL D-SUB RECEP

SOT-23

638-M26-332-BN3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact Plating15 Microinches of Gold Plating
Mounting Feature#4-40 UNC Insert + Board Spacer
Gender Receptacle (Socket)
Position 26
Contact Description Solder Cup
Insulator Color Black
Shell PlatingNickel
In-Stock:753 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$11.94000$11.94
500$11.8206$5910.3
1000$11.7012$11701.2
1500$11.5818$17372.7
2000$11.4624$22924.8
2500$11.343$28357.5

About 638-M26-332-BN3

The 638-M26-332-BN3 from EDAC Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features 638M SERIES VERTICAL D-SUB RECEP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 638-M26-332-BN3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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