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170M6695

170M6695

170M6695

Eaton - Bussmann Electrical Division

170M6695 datasheet pdf and Electrical, Specialty Fuses product details from Eaton - Bussmann Electrical Division stock available on our website

SOT-23

170M6695 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Mount Bolt
Mounting Type Bolt Mount
Package / Case Rectangular, Blade
Number of Pins 2
Weight 1.224699kg
PackagingBulk
Published 2011
Size / Dimension 2.913Lx2.992W x 3.622 H 74.00mmx76.00mmx92.00mm
Feature Indicating
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Electrical
Applications Electrical, Industrial
Voltage - Rated 1.3kV
Current Rating (Amps) 700A
Current Rating700A
Voltage - Rated AC 1.3kV
Approval Agency CSA, UR
Current 700A
Fuse Type Square
Breaking Capacity @ Rated Voltage 100kA
Melting I2t 115000
Height 91.9988mm
Length 159.004mm
Width 75.9968mm
RoHS StatusRoHS Compliant
In-Stock:49 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$413.68000$413.68

About 170M6695

The 170M6695 from Eaton - Bussmann Electrical Division is a high-performance microcontroller designed for a wide range of embedded applications. This component features 170M6695 datasheet pdf and Electrical, Specialty Fuses product details from Eaton - Bussmann Electrical Division stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 170M6695, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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