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170M3397

170M3397

170M3397

Eaton - Bussmann Electrical Division

170M3397 datasheet pdf and Electrical, Specialty Fuses product details from Eaton - Bussmann Electrical Division stock available on our website

SOT-23

170M3397 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Mount Bolt, Holder
Mounting Type Holder
Package / Case Rectangular, Blade
Number of Pins 2
Weight 204.116567g
PackagingBulk
Published 2011
Size / Dimension 2.322Lx1.772W x 2.953 H 59.00mmx45.00mmx75.00mm
Feature Indicating
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Electrical
Applications Electrical, Industrial
Voltage - Rated 1.3kV
Current Rating (Amps) 350A
Current Rating350A
Voltage - Rated AC 1.3kV
Approval Agency CSA, UR
Current 350A
Fuse Type Square
Breaking Capacity @ Rated Voltage 100kA
Melting I2t 27000
Height 75.0062mm
Length 58.9788mm
Width 45.0088mm
RoHS StatusRoHS Compliant
In-Stock:59 items

Pricing & Ordering

QuantityUnit PriceExt. Price
4$367.21750$1468.87

About 170M3397

The 170M3397 from Eaton - Bussmann Electrical Division is a high-performance microcontroller designed for a wide range of embedded applications. This component features 170M3397 datasheet pdf and Electrical, Specialty Fuses product details from Eaton - Bussmann Electrical Division stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 170M3397, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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