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AP2602FNTR-G1

AP2602FNTR-G1

AP2602FNTR-G1

Diodes Incorporated

THERMOSTAT PROG ACTIVE LOW 16QFN

SOT-23

AP2602FNTR-G1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 26 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-VFQFN Exposed Pad
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2012
JESD-609 Code e3
Feature Selectable Trigger Voltage, Selectable Trip Point
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
Terminal Finish MATTE TIN
HTS Code8542.39.00.01
Voltage - Supply 2.7V~5.5V
Terminal Position QUAD
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch0.5mm
Output Active Low
JESD-30 Code S-XQCC-N16
Output Type Open Drain
Max Output Current20mA
Operating Supply Voltage5.5V
Supply Voltage-Min (Vsup) 2.7V
Analog IC - Other Type ANALOG CIRCUIT
Operating Supply Current 55μA
Output Function/OverTemp
Switching TemperatureProgrammable
Selectable Hysteresis No
Trip Temperature Threshold Hot
Height Seated (Max) 0.9mm
Length 3mm
Width 3mm
RoHS StatusROHS3 Compliant
In-Stock:35904 items

Pricing & Ordering

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About AP2602FNTR-G1

The AP2602FNTR-G1 from Diodes Incorporated is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERMOSTAT PROG ACTIVE LOW 16QFN.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the AP2602FNTR-G1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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