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2713/2

2713/2

2713/2

Daburn Electronics

2713/2 datasheet pdf and Multiple Conductor Cables product details from Daburn Electronics stock available on our website

SOT-23

2713/2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Package / Case 100
Insulation Material Copper
Conductor MaterialCopper, Bare
Jacket (Insulation) Material Poly-Vinyl Chloride (PVC)
Shield Material Copper, Tinned
Operating Temperature-40°C~90°C
PackagingSpool
Published 2015
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Conductors 2
Wire Gauge36 AWG
Voltage 200V
Cable TypeMulti-Conductor
Wire/Cable Gauge 2 AWG
Jacket Color Black
Conductor Strand25/50
Jacket (Insulation) Diameter 0.052 (1.32mm)
Conductor Insulation Poly-Vinyl Chloride (PVC)
Shield Type Braid
Length 100.0' 30.5m
Jacket (Insulation) Thickness 0.0100 0.254mm
RoHS StatusROHS3 Compliant
In-Stock:56 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$229.07000$229.07
5$203.61600$1018.08
10$184.52700$1845.27
25$171.80120$4295.03
50$165.43800$8271.9

About 2713/2

The 2713/2 from Daburn Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features 2713/2 datasheet pdf and Multiple Conductor Cables product details from Daburn Electronics stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2713/2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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