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2710/3

2710/3

2710/3

Daburn Electronics

2710/3 datasheet pdf and Multiple Conductor Cables product details from Daburn Electronics stock available on our website

SOT-23

2710/3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Package / Case 100
Insulation Material Copper
Conductor MaterialCopper, Bare
Jacket (Insulation) Material Poly-Vinyl Chloride (PVC)
Shield Material Copper, Tinned
Operating Temperature-40°C~90°C
PackagingSpool
Published 2015
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Conductors 3
Wire Gauge30 AWG
Voltage 200V
Cable TypeMulti-Conductor
Wire/Cable Gauge 3 AWG
Jacket Color Black
Conductor Strand41/46
Jacket (Insulation) Diameter 0.076 (1.93mm)
Conductor Insulation Poly-Vinyl Chloride (PVC)
Shield Type Braid
Length 100.0' 30.5m
Jacket (Insulation) Thickness 0.0100 0.254mm
RoHS StatusROHS3 Compliant
In-Stock:62 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$265.43000$265.43
5$235.93600$1179.68
10$213.81700$2138.17
25$199.07120$4976.78
50$191.69800$9584.9

About 2710/3

The 2710/3 from Daburn Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features 2710/3 datasheet pdf and Multiple Conductor Cables product details from Daburn Electronics stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2710/3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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