S29GL512P11TAI010 Overview
There is a memory type Non-Volatile for this type of device. There is a Tray case available. As you can see, it is embedded in 56-TFSOP (0.724, 18.40mm Width) case. The chip has an 512Mb 32M x 16 memory. FLASH-format memory is used in this device, which is a mainstream design. Featuring an extended operating temperature range of -40°C~85°C TA, this device allows it to be used in a variety of demanding applications. It is capable of handling a voltage supply of 2.7V~3.6V. There is a recommendation that Surface Mount mounting type should be used for this product. 56 terminations are planted on the chip. The comprehensive working procedure of this part involves 1 functions. Memory devices such as this one are designed to be powered by 3V and should be used as such. In this ic memory chip, there is an 56-pin package that encloses the device. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. This memory chip requires only 3/3.3V of power. As a member of the GL-P series memory devices, this part plays an important role for its target applications. In terms of power consumption, it can operate at a maximum supply of 0.11mA . To alter the state of certain nonvolatile memory arrays, 3V programming voltage is required. It is important to keep in mind that this memory has 512 specific sized divisions in total.
S29GL512P11TAI010 Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
56 Pins
S29GL512P11TAI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL512P11TAI010 Memory applications.
- graphics card
- Camcorders
- servers
- nonvolatile BIOS memory
- personal computers
- supercomputers
- data buffer
- Cache memory
- eSRAM
- embedded logic
