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S29GL256P90FFCR12

S29GL256P90FFCR12

S29GL256P90FFCR12

Cypress Semiconductor Corp

3.3V V GL-P Memory IC GL-P Series 13mm mm

SOT-23

S29GL256P90FFCR12 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface MountYES
Number of Pins 64
Operating Temperature0°C~70°C TA
PackagingTape & Reel (TR)
Published 2003
Series GL-P
JESD-609 Code e1
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 3V~3.6V
Terminal Position BOTTOM
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch1mm
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies3.3V
Supply Voltage-Min (Vsup) 3V
Memory Size256Mb 32M x 8
Memory TypeNon-Volatile
Operating ModeASYNCHRONOUS
Supply Current-Max 0.11mA
Memory Format FLASH
Memory InterfaceParallel
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 90ns
Standby Current-Max 0.000005A
Memory Density 268435456 bit
Access Time (Max) 90 ns
Programming Voltage3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
RoHS StatusROHS3 Compliant
In-Stock:2439 items

S29GL256P90FFCR12 Product Details

S29GL256P90FFCR12 Overview


As far as its memory type goes, it falls into the Non-Volatile category. The case comes in Tape & Reel (TR) size. As you can see, it is embedded in 64-LBGA case. This chip has an 256Mb 32M x 8 size of memory on it, so a lot of data can be stored on it. This device utilizes a FLASH format memory which is of mainstream design. Due to its wide temperature range of 0°C~70°C TA, this device is well suited to a wide range of applications that require high performance. It is supplied votage within 3V~3.6V. Its recommended mounting type is Surface Mount. As you can see from the diagram, the chip is planted with 64 terminations. This part supports as many as 1 functions for the comprehensive working procedure. In order to operate this memory device, it must be supplied with 3.3V of power. It is encased in an 64-pin package that contains this ic memory chip. In terms of power requirements, this memory chip uses only 3.3V . Among the GL-P series of memory devices, this part is essential for its applications. As far as the supply current is concerned, it can be operated with a maximum of 0.11mA of currentA programming voltage of 3V is needed to alter the state of certain nonvolatile memory arrays. There are a total of 256 specific sized divisions in this memory.

S29GL256P90FFCR12 Features


Package / Case: 64-LBGA
64 Pins

S29GL256P90FFCR12 Applications


There are a lot of Cypress Semiconductor Corp S29GL256P90FFCR12 Memory applications.

  • telecommunications
  • multimedia computers
  • main computer memory
  • hard disk drive (HDD)
  • cell phones
  • eDRAM
  • networks
  • workstations,
  • eSRAM
  • Camcorders

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