S29GL256P10TFI010 Overview
As far as its memory type goes, it falls into the Non-Volatile category. The case comes in Tray size. The file is embedded in a 56-TFSOP (0.724, 18.40mm Width) case. The chip has an 256Mb 32M x 8 memory. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. The supply voltage can be up to 2.7V~3.6V. Its recommended mounting type is Surface Mount. The chip contains 56 terminations. There are 1 functions supported by this part as part of the comprehensive working process. An 3V supply is required for this ic memory chip to operate properly. The memory device has an 56-pin package, which encloses it in a small package. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. As far as its nominal supply current is concerned, this memory component carries a rating of 110mA. This memory chip requires a mere 3/3.3V of power. This part plays an important role in applications that target the GL-P series of memory devices. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. As a result, this memory has 256 specific divisions of varying sizes.
S29GL256P10TFI010 Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
56 Pins
S29GL256P10TFI010 Applications
There are a lot of Cypress Semiconductor Corp S29GL256P10TFI010 Memory applications.
- mainframes
- eDRAM
- embedded logic
- multimedia computers
- eSRAM
- Cache memory
- data buffer
- supercomputers
- hard disk drive (HDD)
- nonvolatile BIOS memory
