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S29GL256P10FFI022

S29GL256P10FFI022

S29GL256P10FFI022

Cypress Semiconductor Corp

3/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA

SOT-23

S29GL256P10FFI022 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-LBGA
Number of Pins 64
Operating Temperature-40°C~85°C TA
PackagingTape & Reel (TR)
Published 2003
Series GL-P
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) 40
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies3/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size256Mb 32M x 8
Nominal Supply Current110mA
Memory TypeNon-Volatile
Memory Format FLASH
Memory InterfaceParallel
Data Bus Width 8b
Organization 256MX1
Memory Width 1
Write Cycle Time - Word, Page 100ns
Density 256 Mb
Standby Current-Max 0.000005A
Access Time (Max) 100 ns
Sync/Async Asynchronous
Programming Voltage3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
RoHS StatusROHS3 Compliant
In-Stock:1234 items

Pricing & Ordering

QuantityUnit PriceExt. Price
400$6.37900$2551.6

S29GL256P10FFI022 Product Details

S29GL256P10FFI022 Overview


A Non-Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tape & Reel (TR) case as well. The file is embedded in a 64-LBGA case. 256Mb 32M x 8 is the chip's memory size. FLASH-format memory is used in this device, which is a mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. It is recommended to mount it in the Surface Mount mounting type. On the chip, there are 64 terminations. There are 1 functions supported by this part as part of the comprehensive working process. This ic memory chip is designed to be supplied with 3V. It is encased in an 64-pin package that contains this ic memory chip. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. As far as its nominal supply current is concerned, this memory component carries a rating of 110mA. Power supplies for this memory chip are merely 3/3.3V . This part is part of the GL-P series of memory devices, which play a key role in its target applications. 3V programming voltage is required to change the state of certain nonvolatile memory arrays. This ic memory chip has 256 specifically sized divisions in total.

S29GL256P10FFI022 Features


Package / Case: 64-LBGA
64 Pins

S29GL256P10FFI022 Applications


There are a lot of Cypress Semiconductor Corp S29GL256P10FFI022 Memory applications.

  • networks
  • DVD disk buffer
  • telecommunications
  • printers
  • networking
  • mainframes
  • multimedia computers
  • graphics card
  • personal computers
  • cell phones

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