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S29GL128P11FFIV23

S29GL128P11FFIV23

S29GL128P11FFIV23

Cypress Semiconductor Corp

1.8/3.33/3.3V V GL-P Memory IC GL-P Series 13mm mm

SOT-23

S29GL128P11FFIV23 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 64-LBGA
Surface MountYES
Number of Pins 64
Operating Temperature-40°C~85°C TA
PackagingTape & Reel (TR)
Published 2015
Series GL-P
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
ECCN Code 3A991.B.1.A
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code8542.32.00.51
Technology FLASH - NOR
Voltage - Supply 1.65V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3V
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) 40
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies1.8/3.33/3.3V
Supply Voltage-Min (Vsup) 2.7V
Memory Size128Mb 16M x 8
Memory TypeNon-Volatile
Operating ModeASYNCHRONOUS
Supply Current-Max 0.11mA
Memory Format FLASH
Memory InterfaceParallel
Organization 128MX1
Memory Width 1
Write Cycle Time - Word, Page 110ns
Standby Current-Max 0.000005A
Memory Density 134217728 bit
Access Time (Max) 110 ns
Programming Voltage3V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 128
Sector Size 128K
Page Size 8/16words
Ready/Busy YES
Common Flash Interface YES
Height Seated (Max) 1.4mm
Length 13mm
Width 11mm
RoHS StatusROHS3 Compliant
In-Stock:1592 items

Pricing & Ordering

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S29GL128P11FFIV23 Product Details

S29GL128P11FFIV23 Overview


There is a memory type Non-Volatile for this type of device. The case comes in Tape & Reel (TR) size. The case is embedded in 64-LBGA. There is 128Mb 16M x 8 of memory on the chip. FLASH-format memory is used in this device, which is a mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. A voltage of 1.65V~3.6V can be supplied to memory ics. It is recommended that the mounting type be Surface Mount. The chip contains 64 terminations. As many as 1 functions are supported for comprehensive working. In order to function properly, this ic memory chip should be powered by a voltage of 3V. The memory device is enclosed in a package with an 64-pin connector. In terms of power requirements, this memory chip uses only 1.8/3.33/3.3V . This part, which belongs to the GL-P series of memory devices, plays an important role in its target applications. It is able to operate from a max supply current of 0.11mA. The programming voltage required for certain nonvolatile memory arrays is 3V. A total of 128 specific sizes of divisions are present in this memory.

S29GL128P11FFIV23 Features


Package / Case: 64-LBGA
64 Pins

S29GL128P11FFIV23 Applications


There are a lot of Cypress Semiconductor Corp S29GL128P11FFIV23 Memory applications.

  • embedded logic
  • eSRAM
  • servers
  • mainframes
  • personal digital assistants
  • networks
  • cell phones
  • Cache memory
  • printers
  • Camcorders

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