S29GL01GS11TFV010 Overview
There is a Non-Volatile memory type associated with this device. You can get memory ics in a Tray case. The 56-TFSOP (0.724, 18.40mm Width) case contains it. There is an 1Gb 64M x 16 memory capacity on the chip. Memory data is stored in FLASH-format, which is common in mainstream devices. Featuring an extended operating temperature range of -40°C~105°C TA, this device allows it to be used in a variety of demanding applications. The supply voltage can be up to 2.7V~3.6V. The recommended mounting type for memory ics is Surface Mount. The chip contains 56 terminations. In total, this part supports 1 functions. In order to operate this memory device, it must be supplied with 3V of power. In terms of power requirements, this memory chip uses only 3/3.3V . In its target applications, this memory ics plays an important role as a member of the GL-S series of memory devices. In terms of power consumption, it can operate at a maximum supply of 0.08mA . 3V programming voltage is required to change the state of certain nonvolatile memory arrays. A total of 1K specifically sized divisions are contained in this memory.
S29GL01GS11TFV010 Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
S29GL01GS11TFV010 Applications
There are a lot of Cypress Semiconductor Corp S29GL01GS11TFV010 Memory applications.
- hard disk drive (HDD)
- graphics card
- mainframes
- supercomputers
- Cache memory
- multimedia computers
- eDRAM
- embedded logic
- cell phones
- personal digital assistants
