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QMP29GL512P11TFI010

QMP29GL512P11TFI010

QMP29GL512P11TFI010

Cypress Semiconductor Corp

GL-P Memory IC GL-P Series

SOT-23

QMP29GL512P11TFI010 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 56-TFSOP (0.724, 18.40mm Width)
Supplier Device Package 56-TSOP
Operating Temperature-40°C~85°C TA
PackagingTray
Series GL-P
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Memory Size512Mb 32M x 16
Memory TypeNon-Volatile
Memory Format FLASH
Memory InterfaceParallel
RoHS StatusROHS3 Compliant
In-Stock:4073 items

QMP29GL512P11TFI010 Product Details

QMP29GL512P11TFI010 Overview


There is a Non-Volatile memory type associated with this device. The case comes in the Tray style. In the case of 56-TFSOP (0.724, 18.40mm Width), it is embedded within the case. It is estimated that the memory size on the chip is 512Mb 32M x 16. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. The supply voltage can be up to 2.7V~3.6V. The recommended mounting type for memory ics is Surface Mount. This part, which belongs to the GL-P series of memory devices, plays an important role in its target applications.

QMP29GL512P11TFI010 Features


Package / Case: 56-TFSOP (0.724, 18.40mm Width)

QMP29GL512P11TFI010 Applications


There are a lot of Cypress Semiconductor Corp QMP29GL512P11TFI010 Memory applications.

  • graphics card
  • personal computers
  • supercomputers
  • multimedia computers
  • hard disk drive (HDD)
  • servers
  • eSRAM
  • printers
  • data buffer
  • cell phones

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