MB9BF367NBGL-GE1 Overview
The package is FBGA-shaped. There are 80 I/Os. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. 800kB is the size of the memory in the IC part. Using a 160MHz frequency, this electronic part can perform efficiently. On the chip, 112 pins are accessible. There is FLASH memory on this piece of equipment. In addition, it comes with a ARM core architecture.
MB9BF367NBGL-GE1 Features
FBGA package
Minimum temperature of -40°C
MB9BF367NBGL-GE1 Applications
There are a lot of Cypress Semiconductor
MB9BF367NBGL-GE1 Microcontroller applications.
- Instrument control
- Toys
- Robots
- Radio
- Television
- Heater/Fan
- Calculator
- Kindle
- Christmas lights
- 3D printers
