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5962F1120102VXA

5962F1120102VXA

5962F1120102VXA

Cypress Semiconductor

Memory IC 25mm mm

SOT-23

5962F1120102VXA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Surface MountYES
Number of Terminations 165
ECCN Code 9A515.E
Additional FeaturePIPELINED ARCHITECTURE
HTS Code8542.32.00.41
Technology CMOS
Terminal Position BOTTOM
Terminal FormUNSPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-CBGA-X165
Qualification StatusQualified
Operating Temperature (Max) 125°C
Operating Temperature (Min) -55°C
Supply Voltage-Max (Vsup) 1.9V
Temperature GradeMILITARY
Supply Voltage-Min (Vsup) 1.7V
Operating ModeSYNCHRONOUS
Organization 4MX18
Memory Width 18
Memory Density 75497472 bit
Parallel/Serial PARALLEL
Memory IC Type QDR SRAM
Total Dose 300k Rad(Si) V
Length 25mm
Height Seated (Max) 5.38mm
Width 21mm
RoHS StatusNon-RoHS Compliant
In-Stock:1983 items

5962F1120102VXA Product Details

5962F1120102VXA Overview


A total of 165 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 1.8V will be necessary. This chip features all the merits of a conventional chip, but it also features PIPELINED ARCHITECTURE to improve system performance. This chip contains a QDR SRAM type of memory IC. Use it only at temperatures above 125°C. A temperature of -55°C is required for the unit to operate, otherwise, it will not operate.

5962F1120102VXA Features


Additional Feature:PIPELINED ARCHITECTURE


5962F1120102VXA Applications


There are a lot of Cypress Semiconductor
5962F1120102VXA Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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