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SJ-42515RS

SJ-42515RS

SJ-42515RS

CUI Devices

SJ-42515RS datasheet pdf and Barrel - Audio Connectors product details from CUI Devices stock available on our website

SOT-23

SJ-42515RS Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialBrass; Copper Alloy
Mount Through Hole
Mounting Type Through Hole, Right Angle
Housing Material Liquid Crystal Polymer (LCP)
Contact Material - Plating Gold
Operating Temperature-20°C~85°C
PackagingBulk
Series SJ
Published 2002
Feature Board Guide
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Phone Jack
Gender Female
Voltage - Rated 16VDC
Shielding Unshielded
Reach Compliance Code compliant
Current Rating300mA
Number of Positions/Contacts 4 Conductors, 5 Contacts
Internal Switch(s) Single Switch
Body Color Black
Industry Recognized Mating Diameter 2.50mm (0.094, 3/32, Sub Mini, Miniature) - Headphone
Actual Diameter 0.102 (2.60mm)
Signal LinesStereo (4 Conductor, TRRS)
Diameter 2.5mm
RoHS StatusNon-RoHS Compliant
In-Stock:2613 items

About SJ-42515RS

The SJ-42515RS from CUI Devices is a high-performance microcontroller designed for a wide range of embedded applications. This component features SJ-42515RS datasheet pdf and Barrel - Audio Connectors product details from CUI Devices stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SJ-42515RS, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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