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SF100-303005

SF100-303005

SF100-303005

CUI Devices

THERM PAD 30MMX30MM 1 SHEET=98PC

SOT-23

SF100-303005 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Material Silicone Elastomer
Shape Square
Series SF100
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Pad, Sheet
Color Blue
Adhesive Tacky - Both Sides
Outline 30.00mm x 30.00mm
Thermal Conductivity1.5W/m-K
Thickness 0.0197 0.500mm
RoHS StatusRoHS Compliant
In-Stock:852 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$9.056675$9.056675
10$8.544033$85.44033
100$8.060408$806.0408
500$7.604159$3802.0795
1000$7.173735$7173.735

About SF100-303005

The SF100-303005 from CUI Devices is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 30MMX30MM 1 SHEET=98PC.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SF100-303005, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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