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HSE-B381-045H

HSE-B381-045H

HSE-B381-045H

CUI Devices

HEAT SINK, EXTRUSION, TO-220, 38

SOT-23

HSE-B381-045H Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Material Aluminum Alloy
Shape Rectangular, Fins
Package Cooled TO-220
Material Finish Black Anodized
Series HSE
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Board Level, Vertical
Attachment Method PC Pin
Height Off Base (Height of Fin) 0.500 12.70mm
Thermal Resistance @ Forced Air Flow 2.63°C/W @ 200 LFM
Thermal Resistance @ Natural 7.58°C/W
Power Dissipation @ Temperature Rise 9.9W @ 75°C
Length 1.500 38.10mm
Width 1.772 45.00mm
RoHS StatusRoHS Compliant
In-Stock:10129 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About HSE-B381-045H

The HSE-B381-045H from CUI Devices is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEAT SINK, EXTRUSION, TO-220, 38.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HSE-B381-045H, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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