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CSQ-706BP

CSQ-706BP

CSQ-706BP

CUI Devices

AUDIO MAGNETIC XDCR 1-2V TH

SOT-23

CSQ-706BP Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Weight 2g
Operating Temperature-20°C~60°C
PackagingTray
Published 2011
Series CSQ
Size / Dimension 0.472Dia 12.00mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination PC Pins
Max Operating Temperature60°C
Min Operating Temperature -20°C
Voltage - Rated 1.5V
Technology Magnetic
Frequency 2.048kHz
Operating Supply Current 20mA
Operating ModeSingle Tone
Input Type Zero-Peak Signal
Current - Supply 20mA
Voltage Range 1V~2V
Sensing Method Magnetic
Self Resonant Frequency2.05kHz
Washable No
Port Location Top
Sound Pressure Level (SPL) 70dB @ 1.5V, 10cm
Driver CircuitryTransducer, Externally Driven
Diameter 12mm
Height 6mm
Height Seated (Max) 0.236 6.00mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:6872 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.04000$1.04
10$0.82500$8.25
25$0.75080$18.77
50$0.69980$34.99
100$0.65300$65.3
250$0.59432$148.58
500$0.55522$277.61

About CSQ-706BP

The CSQ-706BP from CUI Devices is a high-performance microcontroller designed for a wide range of embedded applications. This component features AUDIO MAGNETIC XDCR 1-2V TH.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CSQ-706BP, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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