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CEM-1606

CEM-1606

CEM-1606

CUI Devices

AUDIO MAGNETIC XDCR 3-12V TH

SOT-23

CEM-1606 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Operating Temperature-20°C~60°C
PackagingTray
Published 2011
Series CEM
Size / Dimension 0.630Dia 16.00mm
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination PC Pins
Max Operating Temperature60°C
Min Operating Temperature -20°C
Voltage - Rated 6V
Technology Magnetic
Frequency 2.048kHz
Operating Supply Current 50mA
Operating ModeSingle Tone
Input Type Zero-Peak Signal
Current - Supply 50mA
Voltage Range 3V~12V
Sensing Method Magnetic
Self Resonant Frequency2.05kHz
Washable Yes
Port Location Top
Sound Pressure Level (SPL) 85dB @ 6V, 10cm
Driver CircuitryTransducer, Externally Driven
Diameter 16mm
Height 14.5mm
Height Seated (Max) 0.571 14.50mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
Ratings Washable
In-Stock:4486 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.064230$2.06423
10$1.947387$19.47387
100$1.837157$183.7157
500$1.733167$866.5835
1000$1.635064$1635.064

About CEM-1606

The CEM-1606 from CUI Devices is a high-performance microcontroller designed for a wide range of embedded applications. This component features AUDIO MAGNETIC XDCR 3-12V TH.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CEM-1606, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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