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AF200-313005

AF200-313005

AF200-313005

CUI Devices

THERMAL INTERFACE MATERIAL, AF20

SOT-23

AF200-313005 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Material Non-Silicone
Shape Rectangular
Series AF200
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Pad, Sheet
Color White
Adhesive Tacky - Both Sides
Outline 31.00mm x 30.00mm
Thermal Conductivity2.0W/m-K
Thickness 0.0197 0.500mm
RoHS StatusRoHS Compliant
In-Stock:466 items

Pricing & Ordering

QuantityUnit PriceExt. Price
4$16.84750$67.39

About AF200-313005

The AF200-313005 from CUI Devices is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERMAL INTERFACE MATERIAL, AF20.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the AF200-313005, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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