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210-10MSTFD

210-10MSTFD

210-10MSTFD

CTS Electrocomponents

SWITCH SLIDE DIP SPST 100MA 20V

SOT-23

210-10MSTFD Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Contact MaterialBeryllium Copper
Mounting Type Through Hole
Surface MountNO
Operating Temperature-40°C~85°C
PackagingTube
Published 2016
Series 210
JESD-609 Code e3
Feature Epoxy Sealed Terminals, Tape Seal
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Number of Positions 10
Terminal Finish Tin (Sn)
Voltage - Rated 20VDC
HTS Code8536.50.90.65
Current Rating (Amps) 100mA
Pitch 0.100 2.54mm Full
Contact Finish Gold
Termination Style PC Pin
Body Breadth 6.7 mm
Actuator Type Slide (Standard)
Circuit SPST
Contact Current(DC)-Max 0.1A
Sealing BOTTOM SEALED; TOP TAPE SEALED
Contact Voltage(DC)-Max 20V
Electrical Life 1,000 Cycles
Switch TypeSLIDE DIP SWITCH
Number of Switch Sections 10
Washable Yes
Actuator Level Raised
Length 1.058 26.87mm
Body Height 3.8mm
Height Above Board 0.190 4.83mm
RoHS StatusRoHS Compliant
In-Stock:14087 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 210-10MSTFD

The 210-10MSTFD from CTS Electrocomponents is a high-performance microcontroller designed for a wide range of embedded applications. This component features SWITCH SLIDE DIP SPST 100MA 20V.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 210-10MSTFD, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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