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SLP121M450C3P3

SLP121M450C3P3

SLP121M450C3P3

Cornell Dubilier Electronics (CDE)

SLP0712TE (750W) 120μF Capacitor ±20% Bulk Through Hole 800mA 0.984Dia 25.00mm -25°C~105°C Polar 10.0076mm Radial, Can - Snap-In

SOT-23

SLP121M450C3P3 Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 24 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can - Snap-In
Dielectric MaterialALUMINUM (WET)
Operating Temperature-25°C~105°C
PackagingBulk
Published 2016
Series SLP0712TE (750W)
Size / Dimension 0.984Dia 25.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Tin (Sn)
Applications General Purpose
Voltage - Rated 450V
Capacitance 120μF
Terminal Pitch10mm
Lead Pitch 10.0076mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 2.765Ohm @ 120Hz
Lead Spacing0.394 10.00mm
Rated (DC) Voltage (URdc)
In-Stock:2673 items

Pricing & Ordering

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About SLP121M450C3P3

The SLP121M450C3P3 from Cornell Dubilier Electronics (CDE) is a high-performance microcontroller designed for a wide range of embedded applications. This component features SLP0712TE (750W) 120μF Capacitor ±20% Bulk Through Hole 800mA 0.984Dia 25.00mm -25°C~105°C Polar 10.0076mm Radial, Can - Snap-In.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SLP121M450C3P3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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